CAS 12159-07-8: Copper silicide (Cu5Si)

S25115 - Copper silicide

Copper silicide thin film is used for passivation of copper-based chips, where it serves to suppress diffusion and electromigration and serves as a diffusion barrier. It is involved in the direct process, the industrial route to organosilicon compounds. This Thermo Scientific Chemicals brand product was originally part of the Alfa Aesar product portfolio. Some documentation and label information may refer to the legacy brand. The original Alfa Aesar product / item code or SKU reference has not changed as a part of the brand transition to Thermo Scientific Chemicals.

Copper silicide is a metal that has a high thermal and electrical conductivity, as well as being chemically stable. It is used in solar panels to transport heat away from the panel. Copper silicide is also used in fabricating semiconductors, as it has low energy requirements. This metal can be fabricated by using laser ablation or chemical vapor deposition techniques. Copper silicide can be used for metallization, due to its low melting point and particle size. The average particle diameter of copper silicide is about 1 micrometre, which makes it ideal for use in the fabrication of optical devices. Copper silicide is also used in microscopy because it has an optical property called second harmonic generation (SHG) that can be used to detect biomolecules such as DNA or proteins.